creat by art - ul recognized file # e-326243 - glass passivated junction - ideal for printed circuit board - typical ir less than 0.1ua - high surge current capability - halogen-free according to iec 61249-2-21 definition symbol unit v rrm v v rms v v dc v i f(av) a i 2 ta 2 sec r jc o c/w t j o c t stg o c document number ds_d1312001 version:d13 note 1 pulse test with pw=300u sec, 1% duty cycle typical thermal resistance 2.3 operating junction temperature range - 55 to + 150 storage temperature range - 55 to + 150 maximum instantaneous forward voltage if= 5 a (note 1) if= 10 a v f 1.0 1.1 v maximum dc reverse current t j =25 at rated dc blocking voltage t j =125 i r 10 500 ua peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 150 a rating for fusing (t<8.3ms) 93 maximum dc blocking voltage 400 600 800 maximum average forward rectified current 10 maximum repetitive peak reverse voltage 400 600 800 maximum rms voltage 280 420 560 mounting torque 8.17 in-lbs maximum weight 4 gram (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter TS10K40 ts10k60 ts10k80 ts4k mechanical data case ts4k molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free, rohs compliant terminal matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test polarity polarity as marked on the body TS10K40 thru ts10k80 taiwan semiconductor glass passivated brid g e rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec
part no. note 1: "xx" defines voltage from 400v (TS10K40) to 800v (ts10k80) part no. ts10k80 ts10k80 (ta=25 unless otherwise noted) document number ds_d1312001 version:d13 ratings and characteristics curves TS10K40 thru ts10k80 taiwan semiconductor ts10k80 d3 d3 ts10k80 d3g d3 g green compound example preferred p/n packing code green compound code description package packing ts10kxx (note 1) d3 suffix "g" ts4k 25 / tube x2 ts4k forming ordering information packing code green compound code 0 2 4 6 8 10 12 50 60 70 80 90 100 110 120 130 140 150 average forward a current (a) case temperature ( o c) fig.1 forward current derating curve resistive or inductive load with heatsink 0 50 100 150 200 250 300 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine wave jedec method 0.001 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse current (ua) percent of rated peak reverse voltage (%) fig. 2 typical reverse characteristics tj=25 tj=125 0.1 1 10 100 0.4 0.6 0.8 1 1.2 1.4 instantaneous forward current (a) forward voltage (v) fig. 4 typical forward characteristics
min max min max a 24.70 25.30 0.972 0.996 b 2.00 2.30 0.079 0.091 c 0.90 1.10 0.035 0.043 d 7.30 7.70 0.287 0.303 e 3.00 5.00 0.118 0.197 f 14.70 15.30 0.579 0.602 g 3.30 3.70 0.130 0.146 h 17.00 18.00 0.669 0.709 i 4.40 4.80 0.173 0.189 j 3.40 3.80 0.134 0.150 k 9.30 9.60 0.366 0.378 l 3.10 3.60 0.122 0.142 m 3.10 3.40 0.122 0.134 n 0.50 0.70 0.020 0.028 p/n = specific device code g = green compound yww = date code f = factory code document number ds_d1312001 version:d13 TS10K40 thru ts10k80 taiwan semiconductor package outline dimensions dim. unit(mm) unit(inch) marking diagram 0 50 100 150 200 250 300 0.1 1 10 100 j unction capacitance (pf) a reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp-p
|
